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Home | Our Technologies | Pulse Plating

Pulse Plating

Advantages:

 

Possibilities:

  • Increase of the deposit homogeneity due to a higher throwing power even at complex shaped parts
  • Increased layer density, elimination of pores
  • Reduction of raw materials and organic bath additives
  • Improvement of the resulting layer properties e.g. hardness
  • Acceleration of your galvanic processes
  • Functionalizing by combination with dispersion coating

Features:

 

Cathodc puls(es)
short pulses with a higher current density lead to an increased nucleation process

Anodic puls(es)
very short pulses with a high current density with a leveling and smoothening effect Off-time Allows the desorption of impurities and the diffusion of the active species towards the surface  

Specifications:

  • Reduction of the deposited crystallite size starting from microns with DC down to nanocrystalline layers using pulse plating
  • Significant increase in density and homogeneity of the deposited metal layers
  • Dramatical improvement of the layer properties e.g. the corrosion stability
  • Controlling your alloy composition just altering the pulse sequence
  • Tailor the microstructure of your deposit by modifying the pulse sequence
  • Most of the systems nickel, copper, gold, silver, rhodium, chromium, zinc and tin can be easily transferred to pulse plating
  • Rack plating, barrel plating and continous strip plating processes can be realised
  • Knowledge based definitions of the pulse sequence for best results
  • Technical realisation by specialists even in existing plating lines
  • Adaptation of the method is possible in various plating baths and electrolytes

High-Tech surface finishing for High-Tech applications!

A broad field of high precision and high performance applications for tool, machine and electronic industry can be optimised.

Example of use: Pulse plating of nickel:

  • Reduction of the plating time due to a higher deposit uniformity
  • The uniformity can be improved from a ratio of 1.5 (edges to corners) at DC plating to a ratio better than 1:1.5 with pulse plating
  • Reduction of time and material
  • Increased corrosion stability due to dense, compact nickel layers

Example Nickel-cobalt

Altering the deposit structure:

By adjusting the pulse sequence, the micro structure of the nickel layer can be modified e.g. from columnar growth to lamellar growth!

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